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Gary Dickerson
President, Chief Executive Officer & Executive Director, Applied Materials, Inc

The Next AI Chips Are About to Get Insanely Complex

📅 Sep 09, 2026 Six Five Media 22 MIN 5477 VIEWS 39 SEGMENTS · 3 SPEAKERS
00:00:00 - The Impact of AI on Industries 00:00:14 - Introduction to Gary Dickerson 00:00:56 - The Role of AI in Chip Making 00:01:48 - AI: Early Stages of Innovation 00:04:18 - Demand for Semiconductors 00:05:02 - Pervasiveness of AI and Computing Demand 00:06:48 - Long-Term Demand Projections 00:07:44 - Beyond Just Chip Production 00:08:37 - Opportunities for Efficiency in AI 00:09:31 - Co-Innovation in the Technology Stack 00:10:57 - Advanced Packaging and Its Importance 00:12:27 - Vision for Epic and Future Innovations 00:14:10 - Epic as a Technology Incubator 00:16:22 - Commercialization...

What Gary Dickerson said

Written from the verified transcript and checked against it. Every figure links to the moment it was said.

Gary Dickerson, CEO of Applied Materials, said AI is the biggest inflection of our lifetimes and will transform every industry, touching every individual. He argued the race for AI compute leadership is the most important race determining who wins and loses globally. Dickerson said AI demand will keep increasing, driven by agents and pervasive adoption, and that wafer fab equipment growth this year is about 80% driven by AI in advanced logic, memory including high bandwidth memory, and advanced packaging. He highlighted Applied Materials' number one position in these segments and its service business growing at 20% CAGR. Dickerson described the $5 billion Epic investment in Silicon Valley as enabling high-velocity co-innovation, bringing materials innovations to market faster. He emphasized the drive for tokens per second per watt and cost per token, and that advanced packages will have over 300 chips and 500 billion transistors next year. He stressed commercialization at high yield, not just innovation, and said material innovation is key to new compute architectures.

Key takeaways

  1. About 80% of wafer fab equipment growth this year is driven by AI in advanced logic, memory including HBM, and advanced packaging.
  2. Applied Materials' service business is growing at a 20% compound annual growth rate.
  3. Advanced packages next year will have over 300 chips, over 500 billion transistors, and over 2,000 miles of wiring.
  4. Applied Materials' advanced packaging business is growing over 50% this year.

Numbers and commitments

FigureWhat it refers toTypeAt
$5 billion Investment in Epic in Silicon Valley commitment 1:10
20% Compound annual growth rate of Applied Materials' service business metric 1:47
80% Share of wafer fab equipment growth driven by AI this year metric 6:48
over 50% Growth of Applied Materials' advanced packaging business this year metric 8:37
over 300 chips Number of chips in an advanced package next year metric 8:37
over 500 billion transistors Transistors in an advanced package next year metric 8:37
over 2,000 miles of wiring Wiring in an advanced package next year metric 8:37
60 miles of wiring Wiring in a smartphone application processor metric 8:37

Chapters

  1. 0:00AI as the biggest inflection
  2. 5:02Demand for compute
  3. 6:48Wafer fab equipment growth
  4. 8:37Opportunities in the tech stack
  5. 14:22Epic vision and co-innovation
  6. 16:35Commercialization and yield
  7. 17:56R&D efficiency and visibility
  8. 19:44Final takeaway on AI

Questions asked in this interview

5
  1. 0:54I think what you were trying to say in the beginning was these people that are creating little miracles every single day, right?
  2. 1:10What do you say when people ask you that question?
  3. 4:21And I don't know it's why is it different than the industry cycles?
  4. 7:43Like where's the biggest opportunities lie for us to get that efficiency?
  5. 19:21What is the one big I've heard a few messages here, by the way, throughout your conversation, but like the one big takeaway on AI and the semiconductor industry that you want all of our viewers to come away with today?
Narrator 0:00 ↗
AI will have a profound impact across everything that we do. And this race for AI compute leadership is the most important race that will determine who wins and loses.
Host 0:14 ↗
Welcome to 65 Summit 2026 AI Unleashed. It is amazing the impact that AI is already having today and I'm even more enthused about what it's going to do in the future. There have been a lot of industry discussions, a lot of discussions around semiconductors, but less about how they actually get built, the equipment, the materials that go into manufacturing because quite frankly, none of this would be possible without companies like Applied Materials. And with that, I'd love to introduce Gary Dickerson, president and CEO of Applied.
Gary Dickerson 0:52 ↗
Well, thank you. Happy to be here with you guys.
Host 0:54 ↗
Yeah, great to see you. Yeah, it's great to have you here. It's great to have you kick off day three for us here at the 65 Summit. I think what you were trying to say in the beginning was these people that are creating little miracles every single day, right? That are changing our world.
Gary Dickerson 1:09 ↗
Big miracles.
Host 1:10 ↗
Yes. Many many small ones and many big ones. Okay. We will we absolutely agree. All right. So, I want to ask you something. Clearly you know you're building Epic right now, investing $5 billion here in the heart of Silicon Valley to revolutionize the future of chipmaking. So you feel very optimistic about AI and where we're heading with all this stuff. But where are we with AI? Because this is a question I get asked a lot when I'm doing interviews. I'm flipping the script here. I'm asking you the question. Are we in the first inning? Are we in the fifth inning? Is it halftime? Are we in the pregame? What do you say when people ask you that question?
Gary Dickerson 1:47 ↗
Yeah. So I think AI is the biggest inflection of our lifetimes. I think it's going to transform every industry. It's going to touch every individual. So you know for me I look at how we're implementing AI inside Applied Materials. So we're innovating the way we innovate. We're innovating the way we bring products to market. We're innovating in our operations and supply chain in our services across the entire company. And the big focus for me is not headcount savings. It's bringing products and services to market, miracles to market faster and driving topline growth. And so what is super clear to me is that the opportunity is tremendous. We are bringing products to market faster. We have a service business that's growing at a 20% compound annual growth rate. And I could bring services to market because these tools are incredibly complex. Our customers want to innovate with AI computing with new materials and new architectures, but also they want to yield as fast as possible. It's really hard. So AI really is a game changer in our ability to bring those services and products to market faster and better. So I look at ourselves, where are we at? What inning are we in? We are bringing products to market this year that we wouldn't have been able to bring to market without AI. And I think this is just profound. I think that we will transform every part of the company and I think this technology is at the foundation of competitiveness for everybody. So it is the race for AI compute leadership is profound for every country for every market every company and every individual. So I believe we're very early in what's possible and again AI will have a profound impact across everything that we do and this race for AI compute leadership is the most important race that will determine who wins and loses.
Host 4:18 ↗
I'm putting it in the pregame.
Gary Dickerson 4:19 ↗
Exactly.
Host 4:19 ↗
We are very early. I love that.
I'm getting excited now, Gary. This is great. Me, too. But I got to tell you though, everybody seems to have an opinion on the demand for semiconductors and it's not just oh the next week but it's the next month, it's the next year. You have a view that very few have in the ecosystem. What are you seeing in terms of demand and where do you think it's going? And I don't know it's why is it different than the industry cycles? I mean we you know mainframe to mini to client server local mobile social web e-commerce
Gary Dickerson 4:58 ↗
Yes.
Host 4:59 ↗
A lot of runs.
Gary Dickerson 5:00 ↗
Mobile boom bust.
Host 5:01 ↗
Exactly.
Gary Dickerson 5:02 ↗
So I think this is memory as you said we've been through mainframe to PC and then you've got mobile social media this is way more pervasive than anything that we've ever seen and it's more profound it really is at the foundation of competitiveness for every industry and so you this the computing demand and you also have it's not compute just being consumed by people it's also compute being consumed by agents. And so again I just profoundly believe that the demand is going to continue to increase as we keep driving forward the new AI compute architectures and the innovation and there is more and more adoption of these technologies in every industry and in every company and I mentioned you know what we're doing inside Applied Materials there is zero question my mind at the foundation of competitiveness so yeah again I'm very very confident that this inflection will determine who wins and loses around the world and in every single market and every single industry and so the compute demand is going to keep going up there's zero zero question my mind from the data center to new edge AI types of applications you're going to see more demand for compute and again this is inevitable because the economics are so compelling.
Host 6:33 ↗
Every device every country every industry every workflow that currently exists.
Gary Dickerson 6:39 ↗
Absolutely.
Host 6:40 ↗
So subtly I think he's telling us that that demand curve goes beyond weeks months years and oh yeah you know it's into decades into the future.
Gary Dickerson 6:48 ↗
Absolutely and what we're seeing currently in our business again the race for compute leadership is the most important race. So in wafer fab equipment around 80% of the growth this year is really in the areas that are being driven by AI. So you have advanced logic memory including high bandwidth memory and advanced packaging the multi-chip connectivity. That's about 80% of the wafer fab equipment growth. And again, it's really being driven by AI. Now, also what's great for Applied Materials, we're number one in every one of those different segments that are enabling that AI compute innovation. So, we're seeing tremendous pull from all of the companies that we work with, our customers, and other companies across the ecosystem.

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Cite this transcript

APA, MLA, BibTeX
APA

Dickerson, G. (2026, September 9). The Next AI Chips Are About to Get Insanely Complex [Interview transcript]. Six Five Media. CEOInterviews.AI. https://ceointerviews.ai/interview/1349339/

MLA

Gary Dickerson. "The Next AI Chips Are About to Get Insanely Complex." Six Five Media, 9 Sep. 2026. Transcript, CEOInterviews.AI, https://ceointerviews.ai/interview/1349339/.

BibTeX
@misc{dickerson2026_1349339,
  author       = {Gary Dickerson},
  title        = {The Next AI Chips Are About to Get Insanely Complex},
  howpublished = {Interview transcript, Six Five Media. CEOInterviews.AI},
  year         = {2026},
  month        = {sep},
  url          = {https://ceointerviews.ai/interview/1349339/},
  note         = {Speaker-attributed transcript with timestamps}
}