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Lip-Bu Tan
CEO & Director, Intel

LIVE: COMPUTEX 2026: Intel’s Lip-Bu Tan Reveals Major Strategy for AI and Semiconductors | AI1B

📅 Jun 01, 2026 GBS 84 MIN 166 VIEWS 38 SEGMENTS · 15 SPEAKERS
Intel CEO Lip-Bu Tan takes center stage at COMPUTEX Taiwan, outlining Intel’s vision for the future of AI, semiconductors, data centers, and next-generation computing. As competition intensifies across the global chip industry, Tan’s keynote highlights Intel’s strategy, innovation roadmap, and plans to strengthen its position in the rapidly evolving AI era. Watch the key announcements and industry insights shaping the future of technology. For more details, watch our story and subscribe to our channel Intel CEO Lip-Bu Tan Unveils Bold AI Vision at COMPUTEX Taiwan Amid Chip Race COMPUTEX 2026...

What Lip-Bu Tan said

Written from the verified transcript and checked against it. Every figure links to the moment it was said.

Lip-bu Tan, CEO of Intel, opened the Computex 2026 keynote by reflecting on his 14 months in the role and Intel's 40-year partnership with Taiwan. He emphasized a return to engineering focus, with all engineering reporting to him. Tan highlighted Intel's 18A process at full scale, with products like Core Ultra Series 3 and Core Series 3 achieving nearly 400 designs. He showcased hybrid AI inference with Perplexity, and discussed x86's future, citing IDC projections. He introduced Xeon 6 Plus with 288 E-cores, and announced Rack Scale Blueprints with partners like Foxconn. Tan detailed a partnership with SambaNova for disaggregated inference, claiming 2-3x speedups, and highlighted purpose-built silicon deals with Google and Ericsson. He also introduced collaborations in biomedical and industrial sectors with Echo Neuro, Greenstone, Hitachi, and Siemens, closing with a commitment to transformation and foundry growth.

Key takeaways

  1. Intel's 18A process is at full scale with nearly 400 designs across Core Ultra Series 3 and Core Series 3.
  2. Intel and SambaNova's disaggregated inference is 2-3x faster than GPUs alone, with SM50 rack shipping later this year.
  3. Intel announced Rack Scale Blueprints with Foxconn for agentic performance and density.
  4. Intel is delivering purpose-built silicon to Google and Ericsson, marking entry into custom silicon market.
  5. Xeon 6 Plus with 288 E-cores and 576MB L3 cache launched at Computex.

Numbers and commitments

FigureWhat it refers toTypeAt
14 months Time since Tan became Intel CEO timeline 6:37
40 years Intel's anniversary in Taiwan timeline 6:37
300+ Designs shipping for Core Ultra Series 3 metric 13:51
70+ Designs for Core Series 3 since April metric 13:51
nearly 400 Total designs for Series 3 lineup metric 13:51
40% Performance advantage of ARC G3 over competition metric 13:51
130+ Edge designs for Series 3 products metric 13:51
4,000 Edge ecosystem partners metric 13:51
25 trillion Projected physical AI market by 2050 metric 13:51

Chapters

  1. 0:00Opening and Taiwan partnership
  2. 13:51PC ecosystem and 18A products
  3. 24:38Hybrid AI with Perplexity
  4. 29:44x86 architecture and data center
  5. 42:57Rack Scale Blueprints and Foxconn
  6. 46:48SambaNova partnership and disaggregated inference
  7. 56:03Purpose-built silicon with Google and Ericsson
  8. 59:10Biomedical and industrial partnerships
  9. 1:07:07Closing remarks and transformation

Questions asked in this interview

4
  1. 13:51So, please, a round of applause. Isn't it awesome?
  2. 39:46What's this look like when we multiply that by millions of queries a day?
  3. 49:17Can we talk a little bit more about the work that Intel and SambaNova are doing together?
  4. 56:52How do we bring this out to the external world and do something more?
Narrator 4:53 ↗
Silicon, the foundation of modern technology. Every transistor placed with purpose. Every watt wrestled from physics. Where every instruction set earns its right to execute. This is how performance gets driven. How efficiency gets built. How intelligence acts, not just answers. Our future is with ecosystems shaped by architecture capable of connecting technologies, tools, and partners. Powerful enough to execute, efficient enough to scale, familiar enough to build with speed. Tomorrow, it's about the progress we scale through open platforms, shared standards and partnerships, amplifying each other's strengths. A unified architecture engineered for systems. The next chapter is being written in silicon with our engineering at its heart. Built different, built together, built on Intel.
Host 5:58 ↗
And now, ladies and gentlemen, please give a warm welcome to the CEO of Intel, Lip-bu Tan.
Lip-bu Tan 6:37 ↗
This is the Elephant Mountain, and so 1,000 steps to 184 meters, and so I survived and I came down in one piece. So I'm here. But if I walk a little bit slower, then you know I'm exhausted. But anyway, it's a beautiful view. I mean, highly recommend all of you to do that. I think, first of all, delighted to be here and this is an important event and I'd like to get started. Nearly six decades ago, a group of brilliant and highly motivated engineers and venture capitalists, including Arthur Rock, Don Valentine, and many others, they founded companies like Intel, Apple, and others, broadly setting in motion the largest economic engine known to mankind, creating what became known as Silicon Valley. And this is a very exciting time and that is the very same ambition and mindset with the semiconductors made across the ocean that sparked the creation of Silicon Island right here in Taiwan. And I have been very fortunate to associate with the creation of the semiconductor industry in Taiwan 40 years ago because 40 years ago, Minister KT Lee invited me to lay the foundation of the venture capital concept in Taiwan. It's a very new concept and you know, people put money with you and you play the money and then you share the profit of 20%. But you don't share 20% of the losses. So this is a very unique venture capital concept, but I managed to do that. And then with the help of Minister KT Lee and the Development Fund, I set up my venture fund. And about the same time, you know, Morris Chang from TI came back to EDA and then set up TSMC. So it's a very exciting time that I'm being involved in this whole science park and Hsinchu Science Park and the foundation of becoming the Silicon Island. And so I really see the benefit of, you know, from OEM, ODM, from design to manufacturing, it's all here in Taiwan. Taiwan's PC ecosystem has played a critical role in Intel's growth and success. In fact, last year I was here to celebrate Intel's 40th anniversary in Taiwan. I want to thank all of the suppliers, partners, and customers for 40 years of partnership with Intel. As partnerships continue to grow and stronger every year. It has been a year since I stepped into the role of Intel CEO, to be more precise, 14 months to being CEO of Intel, and it may be the first CEO who can speak Mandarin. And in fact, a couple of customers of Taiwan, very important partners for us, is that Lippo also, very unusual if a CEO can drink liquor with us. But anyway, I'm part of this community. Execution has always been at the top of my list to do. So we had to bring focus back to the core. At our heart, Intel is an engineering company, and that's what I decided from day one I came to become CEO of Intel. I have all the engineering report to me. So they're understanding to really drive the engineering, drive success in engineering performance. Our customers and partners have already seen a shift in the Intel show up. We are just getting started, and so stay tuned. We have a journey in front of us. The opportunity ahead is enormous, and our job is to stay focused, execute, and deliver. Every year, Intel ships hundreds of millions of SOCs, orchestrating silicon across every industry, working tightly with our partners ecosystem across each layer of the stack, from silicon to SOC to system and to software. This generates trillions of dollars in value across four core compute ecosystems. First, personal computers. Second, edge, agentic AI, and later physical AI. Third, foundational data centers. And finally, emerging intelligence centers that will power digital agents of the future. Each of these ecosystems represents generational opportunity, and increasingly, each of these will need purpose-built CPU, GPU, and ASIC solutions for specific workloads and applications. The silicon we are building now will be for human use and the digital agent use. Let us begin with the ecosystem that started it all, to talk more about the PC ecosystem. Please join me to welcome to stage our new leaders for client compute and physical AI, Alex.
Alex 13:51 ↗
Thank you, Lip-bu. Little story about me. The first time I came to Taiwan was the year 1990, and I was fresh out of school. First job, first international trip, first East Asia country I've ever been to. And I came right here in Taipei. And I quickly realized even back then that, you know, the desire to grow, the mindset of win-win and cooperation is all over all of our customers and our partners here in Taiwan. And so it quickly became one of my favorite countries to visit and work. And now, forward the clock 36 years, I'm here in my first international trip with all the great people here at Intel. And where do I come? Right here to Taipei. Thank you. I can't wait to plan and build a future with you guys. So let's get started. We have a lot to cover. Intel has continuously increased the pace of progress across all PC segments: workstations, desktops, creators, gamers, premium and mainstream laptops. Every major segment is driven by an Intel system solution. With that vast coverage in mind, we're adding another dimension to scale these products even more effectively. The Intel 18A process is now at full scale. We have a full lineup of products with hundreds of design wins to prove that. At CES, we launched the Core Ultra Series 3, Intel's first product built on 18A process technology. It's setting a new standard for premium mobile performance and battery life. The Ultra Series 3 enables great user experiences across any tasks with a very fast response CPU, a highly improved GPU, low power processing NPU, and the latest multimedia capabilities. It's a perfect blend of IP performance and power for any AI and agentic experience. It's allowing us to lead the way to transform every PC to an agentic capable platform. Today, more than 300 designs are shipping across consumer and commercial segments, over 300. And to scale these capabilities even further, we've taken the latest Core Ultra IPs and specifically tailored them for the mainstream market. The result, the Intel Core Series 3 introduced in April. Let me repeat, we just introduced this in April and it's already scaled up to 70 plus designs. That brings the total series lineup to nearly 400 designs in just a few short months. Now, that is massive scale. Let's look at some of the capabilities of the Core Series 3. And we can start with battery life. You know, I can go over these numbers here that are printed and I can talk about how we measure them and things like that, but I have a question for you guys. How long is your day? 10 hours, 12 hours, 14 hours, or more like us at Intel? But the great user experience is if your PC lasts longer than your workday. And that's exactly what we're delivering in all segments. And we support ample number of ports for all of your connectivity needs, unlike some of our competitors who only have one USB-C interface. But I'll let you be the judge of that one. The goal of this Core Series 3 is to bring premium feel and experiences to incredibly thin form factors for mainstream PCs. And you know, you don't have to take my word for it. You can look at this wall of incredibly designed, sleek PCs that are here, and all of it is thanks to you, our partners, and our customers. We couldn't have done it without you. So, please, a round of applause. Isn't it awesome? Super light, super thin, really great. Okay. Now, the next proof is scaling 18A IP into growing markets. And the fastest growing portion of the PC market is the handheld gaming. Let's take a look. This is the ARC G3. I think a beautiful chip, more beautiful than what was presented yesterday at a keynote. The G3 is derived from the Core Ultra Series 3 and the ARC G3 is a tuned high-performance GPU specifically for handheld gaming and it's providing great battery life. The performance tested across multiple games is consistent and stable versus competition. We are more than 40% faster, 40% faster, and at the same performance, we're half the power. And on top of that, we're running all AAA games at 1080p resolution, many of them above 120 frames per second. Now, that is giving gamers a great user experience. All of these devices will be available later this month, and this is just the beginning. We're going to have plenty more designs coming throughout the year. Okay, it is indeed true that Intel has a leading lineup of processors and with the versatility of the 18A process technology, our newest offerings, we're bringing powerful performance and efficiency to scale across the breadth of premium, mainstream, and handheld gaming segments. These same fundamentals, the same IP, the same capabilities can deliver far beyond the PC ecosystem. The demand for our processors at the edge has been booming. As you've seen, we've already taken existing product lines and pivoted them into adjacent markets, enabling our customers to grow their businesses. Now, the edge is demanding the latest products from Intel. And that's why this year, we're taking our latest Series 3 products into the edge business with over 130 designs in multiple verticals. For large-scale edge business, our customers need the best technology and chipsets, easy to use reference designs, and appropriate software stacks. And at Intel, we've done all of that. We have over 4,000 edge ecosystem partners deploying into such verticals such as manufacturing, robotics, retail, and many more. For those of you here at Computex, you can see some of that at the pavilion. Given that capability, given the IP, given the chipsets, given the scale that we have, there's a massive opportunity ahead of us across many segments of physical AI. It's projected to be a 25 trillion market by 2050, and it will leverage all of our scale in the PC ecosystem. Physical AI form factors will take shape across key industries, as you see behind me. We will continue growing these markets with the same strategy of leading IP and chipsets, complete reference platforms of end-user hardware and applicable software stacks enabling our customers to expand into new physical AI form factors and applications. And indeed, this will be our future. Now back to you, Lip-bu. Thank you.
Lip-bu Tan 24:38 ↗
Thanks, Alex. AI is profoundly impacting the way we use our devices. A major focus area for us is the use of AI on device. Together with partners, we are at the forefront of advancing intelligence. To tell you more about it, let me welcome on stage my close friend and founder CEO of Perplexity, Aravind. Aravind, welcome. You and I have been talking about hybrid compute for a while. The reasons why are clear, you know, the privacy, cost, performance, and let's talk about how to make this work.
Aravind Srinivas 25:36 ↗
Yeah. So in February we launched Perplexity Computer. Computer is an AI operating system. It creates a team of agents, uses up to 20 different AI models, and it orchestrates across models, tools, and files in one single system. The agent harness inside Computer is model agnostic, perfectly balancing intelligence, accuracy, privacy, and cost is the orchestration problem it solves. And so this allows you to run smaller models locally on the Intel Core Ultra Series 3 GPU. And so for the first time ever, we worked together to create hybrid agentic inference. And so what we are showing today is just the start. Hybrid agentic inference is how we maximize token value per watt per user.
Lip-bu Tan 26:47 ↗
So should we show them how it works?
Aravind Srinivas 26:50 ↗
Yep. All right. So here it is. Let's say I'm an associate at a private equity firm and I'm working on something that has a confidential project code name Project Falcon. Here's the query. So, think of it as me trying to understand if a certain private company is worth $1.1 billion and I'm feeding it confidential deal materials. The work begins on the laptop. It sees that Project Falcon has private deal room files and an NDA, a local leveraged buyout financial model, a whiteboard diagram and bilingual transcripts that are very confidential. You don't want these materials to be shipped to the server. So what the local model does on the Core Ultra Series 3 is it first decides this is all very important work and shouldn't be sent to the server. It reads the files, classifies what is sensitive and what is not, and then Computer decides what should leave the device and what shouldn't, and each of these things is done with local AI. The orchestrator can spin up additional agents as necessary. And so if you need a research agent to bring in outside file materials against local model without exposing any private files, that's what you want in the hybrid system. And so Computer acts as one single system, brings all inputs and outputs together. And so let's actually skip and see what the actual result would be. All right. So the result is a document, a research report and supporting data. And it's been created by agents on large cloud-based models keeping your sensitive information only on your device. And so all your local device models will take care of the private files and the server side models will take care of other things through hybrid inference orchestration. This is the architecture we both believe in and the future is more compute in the data center and more compute on the local machine. And so I think of this as a big milestone for engineering on both the agent harness AI side as well as the chip side. And so it's been really fun to partner with you and Intel on this. So thank you so much, Lip-bu.
Lip-bu Tan 29:44 ↗
Definitely. Thank you, Aravind, and looking forward to continue partnership. Thank you. We talk a lot about the exciting new developments in the PC, edge, and physical AI space. I want to take a few minutes to talk about the foundational IP that power all these advancements. Let us talk about x86. When most people think of general-purpose computing, they think x86, and that is a good reason for that. x86 is an architecture that has powered data centers for nearly five decades and the leadership continues. According to IDC, we expect eight out of the 10 servers installed through 2030 to be x86-based, powering modern computing from foundational to emerging intelligent use cases. Intel pioneered most of the breakthrough architectural innovations that have enhanced x86 over the last four decades, starting with the 8086 that became the foundation of modern computing. If you can see the chart, today we have two flagship CPU cores: P-cores and E-cores. One optimized for performance, the other is for efficiency. These are Intel's most advanced CPU cores with accelerators built in specifically for foundational workloads like security. Our x86 cores power our PC client, edge portfolio, and also power our data center and AI portfolio. Under my leadership, we are committed to building the best CPU cores in the world and we will ensure that the most compute-intensive workloads run best on x86. Next, let us talk about how x86 is enabling foundational data centers. To tell you more about it, let me invite onto the stage Kavouk.
Kavouk 32:49 ↗
Thank you, Lip-bu. Wow. It's so great to be here, specifically in this point in our history, global history, collective history, and be at Computex with the blue badge. So I'm very happy, I'm very humbled to be here to share with you some of the innovations that we have. So let's talk a bit about what this AI thing is about. So when we say foundational, we mean the workloads that keep the world running. So currently we have data centers and there's a number of items and workloads and entities that run on these data centers. So for example, we have 5G networks that keep us connected. We have databases that keep our data safe. We have cloud services that power our daily lives. So we expect demand for these workloads to grow in size and capacity between now and 2030 from 80 gigawatt to about 100 gigawatt. And yeah, most of you involved in this domain understand the extent of this type of an expansion. These workloads are broad. They are mission critical. So special attention has to be taken when running them. But also they require performance, efficiency, security, and resiliency. And we can't emphasize enough all these four factors. That is why we are excited to have Intel Xeon 6 Plus introduced at Computex this week. It has 288 E-cores, a massive 576 megabyte of L3 cache, built with our Intel 18A technology. And we can't emphasize enough the value of Intel technology that brings to data center products. But most importantly, it delivers efficiency and density, which enables our partners to save very precious real estate, have more compact servers and racks. So this is leadership compute for the next era of cloud and network infrastructure. So Xeon 6 Plus launches with the strength of our ecosystem that's been built over decades and decades of data center development both from a hardware but also from a software and infrastructure perspective. Moreover, our ODM partners are bringing Xeon 6 Plus solutions to the market today. So these range from full rack scale deployments to server level designs. Xeon 6 Plus joins our lineup of data center processors next to our already launched Xeon 6 based on P-cores. Both of these categories and classes of solutions deliver new performance and choice for all the enterprises whose infrastructure backbone is built on x86 and Xeon. This is critical for enterprises that need to increasingly balance preparing for AI workloads but at the same time running their day-to-day mission critical applications. So let's switch gears and talk about how Intel is certifying the deployment of intelligence at scale. It's undeniable that enterprise infrastructure today will have to evolve to keep up with the AI demand. Recent research forecasts that AI inference workloads are expected to become 40% of all data center power demand and much more than they are today. So we have these two paradigms where we have the foundational data centers keep on running their traditional workloads but at the same time they have to figure out ways of building their infrastructures to serve intelligence at scale and this is where Intel and Xeon 6 Plus come in. Now up to now, training split the data center into two. So on one hand we have CPU-led enterprise infrastructure and the other hand we have GPU-heavy AI factories and that was a very clear divide for a while, right, and we've all been accustomed to that reality. But as AI moves into real workflows, data tools, governance, the needs change. The next wave is not just about training models. It is about putting AI to work. So let's look at why Agentic AI changes the infrastructure equation. The way AI inference works is straightforward. We take a prompt. It gets fed into an LLM where it spends most time reasoning about the prompt. And we've all seen this. We've done this thousands of times. And out comes an answer. In this case, a lot of time is spent computing the large language model which is mostly GPU and compute intensive. Now the way agentic AI works is radically different. It's given goals rather than prompts. So we've all seen the different types of loop that people are running on this agentic AI. It's also very iterative in nature but also prompted by automation and thinking, planning, acting, and reflecting are a natural way of these agents interacting with us. As it works, it uses tools, reads and writes files, checks rules and other aspects that were, you know, in the traditional realm of CPUs and x86. And then for each step, the type of underlying compute needs is very different. And we'll show that in a bit. This is particularly important as agents scale up their work, spawning new agents that work concurrently. And the category and the complexity of agents are going to be very different depending on the complexity of the work. That's the main reason that there's such a rapid increase in CPU demand for Agentic AI. The CPU orchestrates the show. Now, what we're seeing is we're also seeing the balance and the ratio of one CPU to 8 GPUs and more is coming much closer to par. So, let's take a look at the real example. John.
John 39:46 ↗
Thanks, Kavouk. You talked about how Agentic AI is changing the compute requirements. Let's take a look at a real example. I have a traditional AI inference setup on the left-hand side of the screen. Let's send a request. Write a Python function that calls an OpenAI compatible chat completions API. The model gets the response, generates code, and sends the request back. Take a look at the slider on the top of the screen. GPU dominates nearly 7 to 1, GPU heavy. In contrast, let's take a look at an Agentic AI system. Across the top, look at the pipeline stages. Green is GPU work. Blue is CPU work. Linting is happening on our Xeon 6 Plus processor with efficiency cores. Web fetch and compile is happening on our Xeon 6 performance cores and unit testing is coming back and running on our Xeon 6 Plus efficiency cores. The right class CPU for each stage of the pipeline. Take a look at the slider across the top again. We're near par, but CPU heavy this time. What's this look like when we multiply that by millions of queries a day? As you mentioned, each Xeon 6 Plus processor has up to 288 cores. That's 576 cores per two-socket server. When we look at that from a rack scale perspective, that gives us over 36,000 cores per 32U of compute space.
Kavouk 41:22 ↗
Thank you, John. Wow, this is pretty amazing and some data to ponder on. By far the density of CPU we showed has the highest density per rack ever. But also looking at the number of agents and these are the new metrics that are emerging. We can safely say that that particular rack can run up to 150,000 agents. So good news to all the CIOs in the audience. Now your very expensive GPUs can see more utilization because of our solutions. Now both Xeon 6 with P-cores and E-cores are built for intelligence at scale. There are different cores of course but we've seen the workloads that require very high performance cores pushing the frequencies but also there's a need for very high density, power efficient cores. So we've seen all the workloads, we've run all the analysis and we are delivering these solutions to all of you now. Having said that, we are working with our customers and partners to make sure that each solution is tailored to your needs. So, I'd like to welcome Lip-bu back on stage to talk about the server and rack scale solutions that our partners are working on. Thank you.
Lip-bu Tan 42:57 ↗
Thank you, my friend. Thank you, Kavouk. It is great to see the momentum in the data center. As we look forward, we see that for intelligence at scale, discrete compute alone is not enough. Our customers are asking us to think at the system level to help them serve real agentic workloads at scale. It pushed us to rethink how we deliver our compute beyond the socket and to the rack. That is why we started the initiative called Rack Scale Blueprints. Working with ecosystem partners to develop rack scale blueprints built on open standards so customers can rapidly scale their intelligent infrastructure with confidence without proprietary workarounds. Behind me, as you can see, two examples of these blueprints. One is for agentic performance based on Intel Xeon 6 with P-cores. The other is agent density with the Intel Xeon 6 Plus with E-cores. We are working closely with our partners ecosystem including Foxconn and others to expand our rack scale offering. Let me call on stage one of our partners, Chief Product Officer of Foxconn, Jerry Xiao, to talk about how we partner on rack scale solutions.
Jerry Xiao 44:56 ↗
Thank you, Lip-bu. I'm so excited to be here today. Wonderful product and amazing event. Lip-bu, Intel and Foxconn have been working together for many decades and Foxconn has been instrumental in driving technology innovation in Taiwan and around the world. Yeah, that's right. I'm proud of the work we have done together from AI servers to data centers and to edge computing all together. And today we're excited to announce the next step in our partnership. Intel and Foxconn are working together to develop rack scale products built upon Intel Xeon processors. Together we will focus on exploring the development, integration, and commercialization of differentiated rack scale AI infrastructure solutions leveraging complementary architectures to address diverse AI workload requirements. Yeah, together we will continue to deepen and expand our partnership, unlocking new opportunities ahead. Through this collaboration, we will deliver system-level AI solutions to our joint customers, enabling more integrated and scalable computing environments. This marks an important step ahead and we look forward to unveiling more in the near future. Thank you, Lip-bu.
Lip-bu Tan 46:48 ↗
Today is an exciting milestone for our continual partnership with Foxconn. Jerry, thank you for joining us. Thank you to the many partners in the audience today that are helping to bring this rack scale vision to life, providing choice throughout the ecosystem. We do not believe one size fits all approach for intelligent centers. Each enterprise will run unique workloads. So their infrastructure needs will also need to be unique and purpose-built as you can see from the screen here. Just look at the server in front of me. This is a whole series of partnerships we have. Intel is working with a lot of partners to provide server rack scale solutions designed to fit your existing infrastructure, ready for AI at scale. As you can tell in front of you, we see token usage exploding. Agents now consume 1,000 times more tokens than single event reasoning. In addition to building the best CPUs, it is critical that we deliver compute solutions optimized for token consumption and token generation. The bottom line, AI at scale will require heterogeneous computing. To this end, Intel recently announced a partnership with SambaNova. To talk more about this, let me call to the stage founder CEO of SambaNova, Rodrigo Liang.
Rodrigo Liang 49:17 ↗
Thank you, Lip-bu. And over the next few months we have announced a few updates on our joint development partnership. Can we talk a little bit more about the work that Intel and SambaNova are doing together?
Lip-bu Tan 49:35 ↗
Absolutely. We've been busy. Earlier this year we announced a multi-year collaboration to deliver high-performance, cost-efficient AI inference solutions based on Xeon infrastructure. We've been building something really special. Excited to show you today. This is the SM50 SambaNova rack. We announced earlier this year. Rack scale AI infrastructure built for agentic workloads. It uses Intel Xeon 6 processors with SambaNova SM50 RDUs and shipping to customers later this year. Today, we're also excited to demonstrate the world's first heterogeneous disaggregated inference using SambaNova's RDU with Intel's CPU and NVIDIA GPUs. What you're about to see is the same prompt, the same model running side by side, two different stacks. So the one on the left is GPUs, RDUs, and CPUs disaggregated inference. And this one on my right is GPUs on their own. They both get fed the same prompt and the same model just different stacks. The disaggregated inference stack is taking off. And what's happening here is you have the Xeon 6 processors doing all the tooling execution. You have SambaNova RDUs doing the decode and generating all of the tokens. And then you got the GPUs performing the prompt caching and the faster prefill reducing overall time. When all three chips are working together, you dramatically reduce the end-to-end latency and the agents for the fastest need for agentic AI and on the other side the GPU stack is still working away. So the initial result of our work is disaggregated inference is the GPUs, the RDUs, the CPUs. That's the fastest. And artificial analysis and our test found it to be two to three times faster than just the GPUs alone. And this gives us an early look at how fast this can be. Rodrigo, the most exciting part about all this is that we have tremendous customer interest in these solutions.
Rodrigo Liang 52:15 ↗
Absolutely. So, let's see who comes next. So, turn it back over to you.
Lip-bu Tan 52:20 ↗
Thank you so much. To continue this conversation, I'm delighted to invite my good friends, you know, Robert Smith is Vista Equity Partners, Chairman, CEO and Managing Partner, and Roger Smith to tell you more about how they plan to use these racks from Intel and SambaNova. Robert.

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APA

Tan, L. (2026, June 1). LIVE: COMPUTEX 2026: Intel’s Lip-Bu Tan Reveals Major Strategy for AI and Semiconductors | AI1B [Interview transcript]. GBS. CEOInterviews.AI. https://ceointerviews.ai/interview/958973/

MLA

Lip-Bu Tan. "LIVE: COMPUTEX 2026: Intel’s Lip-Bu Tan Reveals Major Strategy for AI and Semiconductors | AI1B." GBS, 1 Jun. 2026. Transcript, CEOInterviews.AI, https://ceointerviews.ai/interview/958973/.

BibTeX
@misc{tan2026_958973,
  author       = {Lip-Bu Tan},
  title        = {LIVE: COMPUTEX 2026: Intel’s Lip-Bu Tan Reveals Major Strategy for AI and Semiconductors | AI1B},
  howpublished = {Interview transcript, GBS. CEOInterviews.AI},
  year         = {2026},
  month        = {jun},
  url          = {https://ceointerviews.ai/interview/958973/},
  note         = {Speaker-attributed transcript with timestamps}
}