🔊CEOInterviews

Elif Balkas on AI demand

From 300mm SiC: The Building Block for AI and HPC Advanced Packaging | Dr. Elif Balkas, Wolfspeed · · Power Electronics News

“The unprecedented development in AI and the huge demand both on the power side of things as well as the thermal management and the design and the architecture side of things. There are a lot of components there that the wideband gap materials and the electronics specifically silicon carbide could address.”

Elif Balkas
Chief Technology Officer, WOLFSPEED INC
AI demandthermal managementwideband gap materials

On , Elif Balkas, Chief Technology Officer at WOLFSPEED INC, spoke about AI demand during 300mm SiC: The Building Block for AI and HPC Advanced Packaging | Dr. Elif Balkas, Wolfspeed on Power Electronics News.

300mm SiC: The Building Block for AI and HPC Advanced Packaging | Dr. Elif Balkas, Wolfspeed
Watch on YouTube at 1:32
300mm SiC: The Building Block for AI and HPC Advanced Packaging | Dr. Elif Balkas, Wolfspeed
Power Electronics News
Watch on YouTube at 1:32
In this episode of PEN's Power Corner, Aalyia Shaukat speaks with Dr. Elif Balkas, CTO of Wolfspeed, about the company's 300-millimeter silicon carbide (SiC) technology and its significance for AI and high-performance computing (HPC) infrastructure. Dr. Balkas explains how Wolfspeed leveraged decades of crystal growth expertise to scale SiC wafer diameter to 300 mm—a move driven by the AI industry's demand for CMOS-compatible substrates and next-generation co-packaging architectures. The conversation covers how SIC’s unique combination of thermal conductivity, electrical insulation, mechanical strength, and resistivity makes it a compelling alternative to silicon and glass interposers in advanced packaging. Furthermore, how Wolfspeed’s 40+ year heritage and vertically-integrated supply chain are critical as they work towards commercialization. Dr. Balkas discusses the industry's looming thermal wall in data centers, anticipated to come in the next 2-3 years. She discusses how processor throttling due to heat is already a design constraint, and how SiC can help designers simplify architecture, reduce hot spots, and extract more value from increasingly power-dense packages. Dr. Balkas also addresses Wolfspeed's broader data center strategy—from its recently commercialized 10 kV SiC MOSFET for solid-state transformer (SST) applications to ongoing collaboration with foundries and OSATs on hybrid SiC-silicon packaging integration. She closes with a longer-range vision for SiC in optical interconnects, co-packaged optics, and eventually quantum computing—describing it as a material that, at the physics level, just keeps giving. 🎙 Listen to EE Times On Air podcasts on power, embedded, AI, and more: https://www.eetimes.com/podcasts/?utm... 🎥 Don't miss an episode and subscribe to our YouTube channel:    / @eetimes747   Stay up to date with the latest news in the electronics industry ➡️ EE Times: https://www.eetimes.com/?utm_source=e... ➡️ Power Electronics News: https://www.powerelectronicsnews.com/... ➡️ Embedded: https://www.embedded.com/?utm_source=... ➡️ EDN: https://www.edn.com/?utm_source=eetim... 📰 Subscribe to our newsletters: https://aspencore.dragonforms.com/loa... 🖥️ Attend free tech webinars: https://www.eetimes.com/webinars/?utm... 📈 Download free industry white papers: https://www.eetimes.com/techpapers/?u... 🎤 Check out our virtual events on EE Times: https://events.eetimes.com/?utm_sourc... 🎉 Interested in advertising opportunities? Reach out to [email protected]
Elif Balkas

About Elif Balkas

Chief Technology Officer · WOLFSPEED INC

In a recent appearance on *Power Electronics News*' Power Corner, Wolfspeed CTO Elif Balkas discussed the company's 300-millimeter silicon carbide (SiC) technology and its applications for AI and high-performance computing (HPC) infrastructure. Balkas stated that the company leveraged decades of crystal growth expertise to scale SiC wafer diameter to 300 mm, driven by industry demand for CMOS-compatible substrates and next-generation co-packaging architectures. She noted that silicon carbide offers thermal conductivity close to 500 W/mK, compared to silicon's 130 W/mK, and said that inserting a SiC layer into a simple architecture can provide a 10 to 15% improvement in heat removal efficiency. Balkas also said that compared to silicon IGBT-based systems, SiC offers a 30% system cost reduction, three times the power density improvement, and around 99% conversion efficiency. Balkas described Wolfspeed's collaboration with foundries and OSATs, including TSMC's CoWoS, to integrate hybrid silicon carbide-silicon packaging into established processor packages. She characterized the company's core competency as spanning materials, processing, devices, and advanced packaging. Balkas also discussed the potential for SiC in photonics and quantum computing, describing those applications as "sci-fi a little bit" but expressing confidence that such technologies would be realized.

Profile compiled from Elif Balkas's verified public interviews and appearances. See all quotes & transcripts →

More from Elif Balkas WOLFSPEED INC (WOLF) Full Transcript Explore All Executives