From CAMTEK Metrology Innovations Target Advanced Packaging in Chip Manufacturing · · EE Times Taiwan
“There are two main challenges: the first is the overall economic environment — weak end‑product demand has resulted in relatively low utilization in the fabs.”
On , Rafi Amit, CEO at Camtek, spoke about macroeconomy during CAMTEK Metrology Innovations Target Advanced Packaging in Chip Manufacturing on EE Times Taiwan.
At the 2025 Semicon Taiwan, Rafi Amit, CEO and founder of Camtek, discussed the company’s role as a provider of inspection and metrology systems for the advanced packaging segment of the semiconductor industry. Amit stated that Camtek is responding to new demands from high-performance computing and AI applications, which require detecting defects as small as 150 nanometers. He highlighted the company’s Eagle Gen 5 system with "clear sight technology," which he said suppresses inner layers to reduce false calls and focus on critical defects. Amit described the growth engine for Camtek as "the HPC AI application," adding that the company invests in maintaining competitive advantages through customization and improved throughput and detection. He also noted that weak end-product demand has resulted in low fab utilization, but expressed expectation that the broader economy will improve.