John Lee on advanced packaging
From MALAGA Keynote 9: Dr. John T.C. Lee, the President and CEO of MKS Instruments. · · Jose Pozo CTO Optica Corporate Info Channel
“We address 70% of the steps in making advanced packages, including providing both equipment and chemistry consumables. No other company comes close to that level of coverage.”
On , John Lee, President, Chief Executive Officer & Director at MKS INSTRUMENTS INC, spoke about advanced packaging during MALAGA Keynote 9: Dr. John T.C. Lee, the President and CEO of MKS Instruments. on Jose Pozo CTO Optica Corporate Info Channel.
About John Lee
At a January 2026 Optica VIP reception, Lee stated that semiconductor scaling alone is no longer sufficient for AI performance, which he said is now constrained by how chips are connected, powered, cooled, and packaged. He noted that MKS products are embedded in approximately 85% of wafer-fab equipment and 70% of critical advanced packaging and PCB steps. Lee also remarked that when the Biden administration introduced initial semiconductor restrictions, approximately 15% of MKS's semiconductor equipment revenue from Chinese customers was lost. In October 2024, Lee received the Pinnacle Award from the Asian American Business Development Center. In his acceptance speech, he described his background as a member of the "1.5 generation" — born in Taiwan and moving to the U.S. as a child — and argued that broadening the tent of diversity and inclusion is an essential leadership characteristic. He stated that MKS's revenue grew from $700 million to $3.5 billion during his 15-year tenure. In a separate keynote that month, Lee said advanced packaging is growing at 10% annually and is critical for continuing Moore's Law in the AI era, and that MKS addresses 70% of the steps in making advanced packages. In 2023, Lee discussed China's semiconductor self-reliance, arguing that China remains reliant on Western innovation and has not yet produced genuine domestic sources of non-incremental innovation.