LIVE :Amkor Technology Second Quarter 2026 Earnings Conference Call
Good day ladies and gentlemen and welcome to the Amcore Technology second quarter 2026 earnings conference call my name ...
Chief Executive Officer, Amkor Technology
Search every verified Kevin Engel interview, podcast appearance, and on-the-record quote — each transcript cross-checked by AI and human review to confirm speaker identity. Kevin Engel, CEO of Amkor Technology, discussed the company’s second-quarter 2026 results during an earnings call on July 28, 2026. He reported record quarterly revenue of $1.9 billion, with record revenue in computing, automotive, and industrial segments, and noted year-on-year growth across all end markets. Engel attributed the performance to customer partnerships, technology leadership, and the company’s global footprint, and said demand for advanced packaging continues to expand, with programs on track to support growth in the second half of 2026. He also highlighted recent strategic partnerships with TSMC and Nvidia as reinforcing the role of advanced packaging in the company’s long-term growth opportunities. During the call’s Q&A session, Engel addressed questions about the smartphone outlook, citing market-driven dynamics such as memory pricing and material constraints, as well as a transition of system-in-package (SiP) manufacturing to Vietnam, which he described as a timing issue that could affect build patterns in the third and fourth quarters. He also commented on long-term collaboration with customers, stating that the level of visibility is “meaningfully different from previous industry cycles,” and noted that phase one of capacity expansion is fully committed, with future expansion plans under evaluation. Engel acknowledged that U.S. manufacturing costs would be a headwind in the coming year, which the company has factored into its longer-term targets.
Good day ladies and gentlemen and welcome to the Amcore Technology second quarter 2026 earnings conference call my name ...
07/27/2026 Q&A: 22:32 Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mo…
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04/27/2026 Q&A: 16:02 Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mo…
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