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Scott Deboer

Executive Vice President and Chief Technology & Products Officer, Micron Technology

Search every verified Scott Deboer interview, podcast appearance, and on-the-record quote β€” each transcript cross-checked by AI and human review to confirm speaker identity. In a June 2022 podcast, Scott DeBoer discussed Micron's recent progress and technology roadmap. He stated that the company's approach to product leadership involves blending a global, diverse, talented team, which he described as "the industry's best semiconductor development team." DeBoer noted that the company's performance over the prior five years exceeded his pre-COVID expectations, attributing this to a good plan, team flexibility, and remote collaboration. He highlighted a growing partnership with customers in co-inventing products, which he said helps Micron understand product needs early in the development cycle. DeBoer confirmed that Micron plans to implement extreme ultraviolet (EUV) lithography in its fabs by 2024, after a decade of work with a partner, describing the timing as critical due to added costs. He said the company will continue to drive DRAM technology leadership through planar DRAM extension and EUV integration, with a focus on products enabling Compute Express Link (CXL) and High Bandwidth Memory (HBM). Regarding NAND, DeBoer characterized the 176-layer replacement-gate technology as a "great node" that has strengthened Micron's product position, and he noted a transformation toward vertical integration across the NAND portfolio, from the transistor level through firmware and controllers. He described the current period as "a great time to be in memory" and at Micron, citing opportunities in automotive, CXL, and HBM.

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  • Scott DeBoer, Executive Vice President for Technology and Products, Micron

    What role have great engineering and development played in the delivery of great products? How does Micron plan and manage its product transitions with leadership in mind? Let’s talk about one of those initiatives. Last year you announced that Micron would incorporate EUV into your fabs by 2024. How is that progressing? We’ve touched on some of the DRAM nodes, but let’s dig into that roadmap a little bit. What can we expect over the next few years? What is Micron doing to ensure technology leadership in NAND?

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