Saurabh Dighe

Corporate Vice President, Azure Hardware Systems, Microsoft

Search every verified Saurabh Dighe interview, podcast appearance, and on-the-record quote — each transcript cross-checked by AI and human review to confirm speaker identity. Saurabh Dighe, Corporate Vice President of Azure Hardware Systems at Microsoft, discussed the company's Maia 300 AI accelerator in an October 2026 podcast appearance. He described the system as a fully co-designed architecture focused on addressing the "data movement problem" in AI inference, rather than treating it solely as a compute challenge. Dighe detailed the chip's TSMC N2P chiplet design, which enables 18 TB/s of HBM4 memory bandwidth through a memory interface chiplet that expands the die to support eight HBM modules. He stated that the transition from HBM3E to HBM4 improves data transfer rates and power efficiency per bit. Dighe also noted that Microsoft uses AI agents for automated kernel optimization as part of its full-stack approach to maximize "intelligence per watt and per dollar." Dighe said Microsoft's Maia 200 is currently in production and "outperforming some of the GPUs" in the company's fleet. He announced plans to scale Maia deployments to multi-gigawatt capacity starting in 2027, describing this as a "very important strategic positioning" for Microsoft and a key component of its products and services.